Invention Grant
- Patent Title: Cutting method using diamond cutting tool
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Application No.: US17196207Application Date: 2021-03-09
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Publication No.: US12023741B2Publication Date: 2024-07-02
- Inventor: Eiji Shamoto , Hongjin Chung , Takehiro Hayasaka
- Applicant: National University Corporation Tokai National Higher Education and Research System
- Applicant Address: JP Nagoya
- Assignee: NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM
- Current Assignee: NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM
- Current Assignee Address: JP Aichi
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: B23B27/14
- IPC: B23B27/14 ; B23B1/00

Abstract:
Provided is a cutting method of cutting, with a diamond cutting tool, a metal material having at least a solid solution layer on a surface, the solid solution layer containing nitrogen atoms as interstitial solid solution atoms. In this method, cutting is performed in a region where a nitrogen concentration is equal to or greater than a predetermined concentration, and cutting is not performed in a region where the nitrogen concentration is less than the predetermined concentration.
Public/Granted literature
- US20210187622A1 CUTTING METHOD USING DIAMOND CUTTING TOOL Public/Granted day:2021-06-24
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