Invention Grant
- Patent Title: Machining apparatus for laser machining a workpiece and method for laser machining a workpiece
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Application No.: US17617051Application Date: 2020-06-05
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Publication No.: US12023755B2Publication Date: 2024-07-02
- Inventor: Simon Scheidiger , Andreas Luedi , Michael Berger , Martin Mumenthaler
- Applicant: Bystronic Laser AG
- Applicant Address: CH Niederönz
- Assignee: Bystronic Laser AG
- Current Assignee: Bystronic Laser AG
- Current Assignee Address: CH Niederönz
- Agency: BelayIP
- Priority: EP 179047 2019.06.07
- International Application: PCT/EP2020/065623 2020.06.05
- International Announcement: WO2020/245353A 2020.12.10
- Date entered country: 2021-12-07
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/38

Abstract:
A machining apparatus for laser machining a workpiece in a machining zone is provided, having an interface for a machining laser source for generating a machining laser beam with a direction of propagation; an outlet opening for the machining laser beam; and an optical system between the interface and the outlet opening, wherein the optical system has: at least one optical unit that adjusts the focal length of the optical system, and at least one stationary laser beam guiding device with at least one movable surface, wherein the at least one movable surface can be adjusted such that it modifies the focal length of the optical system and/or the beam parameter product of the machining laser beam integrated over time in at least one operating mode. Further provided is a method for laser machining a workpiece.
Public/Granted literature
- US20220266383A1 Machining Apparatus for Laser Machining a Workpiece and Method for Laser Machining a Workpiece Public/Granted day:2022-08-25
Information query
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