Invention Grant
- Patent Title: Laser machining method and laser machining device
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Application No.: US17615714Application Date: 2019-06-05
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Publication No.: US12023760B2Publication Date: 2024-07-02
- Inventor: Hiroki Mori , Saneyuki Goya , Akiko Inoue
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: HAUPTMAN HAM, LLP
- International Application: PCT/JP2019/022399 2019.06.05
- International Announcement: WO2020/245956A 2020.12.10
- Date entered country: 2021-12-01
- Main IPC: B23K26/082
- IPC: B23K26/082 ; B23K26/06 ; B23K26/14 ; B23K26/38 ; B23K26/402 ; B29C69/00 ; B23K103/16

Abstract:
A laser machining method performing cutting machining to cut a composite material over a thickness direction thereof by applying a laser beam to the composite material. The method includes applying the laser beam from one side in the thickness direction of the composite material so as to form a first cutout in the composite material; and applying the laser beam from the other side in the thickness direction of the composite material, forming a second cutout in the composite material at a position opposing the first cutout, connecting the second cutout to the first cutout, and cutting the composite material. The first cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the first cutout. The second cutout is formed by applying the laser beam through a plurality of machining paths arranged in the width direction of the second cutout.
Public/Granted literature
- US20220234144A1 LASER MACHINING METHOD AND LASER MACHINING DEVICE Public/Granted day:2022-07-28
Information query
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