Invention Grant
- Patent Title: Method for supplying resin, method for manufacturing resin molded product, and resin molding apparatus
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Application No.: US17494860Application Date: 2021-10-06
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Publication No.: US12023826B2Publication Date: 2024-07-02
- Inventor: Haruka Ushio , Masayuki Katayama
- Applicant: TOWA Corporation
- Applicant Address: JP Kyoto
- Assignee: TOWA CORPORATION
- Current Assignee: TOWA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JP 20175595 2020.10.19
- Main IPC: B29C31/06
- IPC: B29C31/06

Abstract:
Provided a method for supplying a resin by which appropriate replacement of a cartridge enables resin supply to be performed appropriately. The method for supplying a resin includes: a primary resin supplying step of supplying a liquid resin contained in a first cartridge to a supply target, the first cartridge having a remaining amount of liquid resin smaller than a target supply amount appropriate for one-time resin supply to the supply target; a cartridge replacing step of replacing, after the primary resin supplying step, the first cartridge with a second cartridge already subjected to dripping out; and a secondary resin supplying step of supplying a liquid resin contained in the second cartridge to the supply target after the cartridge replacing step.
Public/Granted literature
- US20220118656A1 METHOD FOR SUPPLYING RESIN, METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT, AND RESIN MOLDING APPARATUS Public/Granted day:2022-04-21
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