Invention Grant
- Patent Title: Molding apparatus
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Application No.: US17465044Application Date: 2021-09-02
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Publication No.: US12023837B2Publication Date: 2024-07-02
- Inventor: Yoshiyuki Fukuhara , Yuji Takada
- Applicant: YKK Corporation
- Applicant Address: JP Tokyo
- Assignee: YKK Corporation
- Current Assignee: YKK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: WO TJP2015086076 2015.12.24 WO TJP2016062281 2016.04.15
- The original application number of the division: US16062038
- Main IPC: B29C48/00
- IPC: B29C48/00 ; A44B18/00 ; A61F13/62 ; B29C39/14 ; B29C43/22 ; B29C43/46 ; B29C69/02 ; B29C43/52 ; B29L31/00

Abstract:
This manufacturing method of a molded surface fastener involves a primary molding step for forming a primary molded body and a secondary molding step for compressing a provisional element of the primary molded body while heating the same. A molding apparatus is provided with a mold member comprising multiple penetration holes and multiple concave portions, whereof each penetration hole communicates to at least one concave portion; in the primary molding step, the molding apparatus is used to form a primary molded body comprising a provisional element having a primary stem portion and a pawl portion is formed from the protruded portion by compressing the provisional element. By this means, it is possible to stably manufacture a molded surface fastener that has an engaging element comprising a pawl portion that projects from the outer peripheral edge of an engaging head portion.
Public/Granted literature
- US20210393001A1 Molding Apparatus Public/Granted day:2021-12-23
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