Invention Grant
- Patent Title: Packaging laminate
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Application No.: US18100077Application Date: 2023-01-23
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Publication No.: US12023899B2Publication Date: 2024-07-02
- Inventor: Lee Phillips Gilbert
- Applicant: BMSI, Inc.
- Applicant Address: US GA Monroe
- Assignee: BMSI, Inc.
- Current Assignee: BMSI, Inc.
- Current Assignee Address: US GA Monroe
- Agency: Bradley Arant Boult Cumnmings LLP
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B27/20 ; B32B27/30 ; B32B27/32
Abstract:
Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
Public/Granted literature
- US20230150249A1 PACKAGING LAMINATE Public/Granted day:2023-05-18
Information query
