Invention Grant
- Patent Title: Adhesion of a substrate onto a CMC component
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Application No.: US17543839Application Date: 2021-12-07
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Publication No.: US12023904B2Publication Date: 2024-07-02
- Inventor: Daniel James Aug , Joshua Daniel Brown , Aaron Michael Dziech , Joseph Herbert Fields , Kenneth Michael Gessner
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- The original application number of the division: US15490138 2017.04.18
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B7/12 ; B32B9/00 ; F23R3/00 ; B32B37/24

Abstract:
Methods for adhering a substrate onto a surface of a ceramic component are provided. The method may include applying a first bond coating onto an attachment surface of the substrate, applying a first alumina coating onto the first bond coating on the attachment surface of the substrate, applying a second bond coating onto an outer surface of the ceramic component, applying a second alumina coating onto the second bond coating on the attachment surface of the substrate, applying a cement onto at least one of the first alumina coating and the second alumina coating, and adhering the attachment surface of the substrate onto the outer surface of the ceramic component. Connections between a metal substrate and a ceramic matrix composite component are also provided.
Public/Granted literature
- US20220088912A1 ADHESION OF A SUBSTRATE ONTO A CMC COMPONENT Public/Granted day:2022-03-24
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