Invention Grant
- Patent Title: Recirculation bypass
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Application No.: US17798902Application Date: 2020-03-11
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Publication No.: US12023937B2Publication Date: 2024-07-02
- Inventor: Jacob M. Lum , Si-lam J. Choy , Jeffrey R. Pollard , Tsuyoshi Yamashita , Jeremy Sells , Garrett E. Clark
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2020/022034 2020.03.11
- International Announcement: WO2021/183121A 2021.09.16
- Date entered country: 2022-08-11
- Main IPC: B41J2/18
- IPC: B41J2/18 ; B41J2/14

Abstract:
A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.
Information query
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