Invention Grant
- Patent Title: Organosilicon compound, method for producing thereof, and use thereof
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Application No.: US17281661Application Date: 2019-09-26
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Publication No.: US12024535B2Publication Date: 2024-07-02
- Inventor: Eun Sil Jang , Takuya Ogawa , Tadashi Okawa
- Applicant: DOW TORAY CO., LTD. , DOW GLOBAL TECHNOLOGIES LLC
- Applicant Address: JP MI Tokyo
- Assignee: DOW TORAY CO., LTD.,DOW GLOBAL TECHNOLOGIES LLC
- Current Assignee: DOW TORAY CO., LTD.,DOW GLOBAL TECHNOLOGIES LLC
- Current Assignee Address: JP Tokyo; US MI Midland
- Agency: WARNER NORCROSS + JUDD LLP
- International Application: PCT/US2019/053146 2019.09.26
- International Announcement: WO2020/072269A 2020.04.09
- Date entered country: 2021-03-31
- Main IPC: C07F9/32
- IPC: C07F9/32

Abstract:
An organosilicon compound having not more than 200 silicon atoms per molecule is provided. The organosilicon compound is represented by the following average compositional formula (I): YaR1bSiO(4-a-b)/2 wherein R1 is an alkyl group having 1 to 12 carbon atoms, alkenyl group having 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms, alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group; Y is a specific acylphosphinate residue; and subscripts a and b are numbers satisfying the following conditions: 0
Public/Granted literature
- US20220017547A1 ORGANOSILICON COMPOUND, METHOD FOR PRODUCING THEREOF, AND USE THEREOF Public/Granted day:2022-01-20
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