Invention Grant
- Patent Title: Polypetide, photoresist composition including the same, and method of forming pattern using the same
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Application No.: US17578720Application Date: 2022-01-19
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Publication No.: US12024540B2Publication Date: 2024-07-02
- Inventor: Soonchun Chung , Ginam Kim , Jieun Kim , Jinha Kim , Joonsong Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: CANTOR COLBURN LLP
- Priority: KR 20210064955 2021.05.20 KR 20210089947 2021.07.08
- Main IPC: C07K14/00
- IPC: C07K14/00 ; G03F7/039
Abstract:
A polypeptide, a photoresist composition including the polypeptide, a photoresist including the polypeptide, and a method of forming patterns using the photoresist composition.
Public/Granted literature
- US20220372078A1 POLYPETIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD OF FORMING PATTERN USING THE SAME Public/Granted day:2022-11-24
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