Invention Grant
- Patent Title: Means for carrying out electroless metal deposition with atomic sub-monolayer precision
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Application No.: US16064140Application Date: 2015-12-23
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Publication No.: US12024778B2Publication Date: 2024-07-02
- Inventor: Rafal Jurczakowski , Piotr Polczynski , Huber Szabat , Aneta Januszewska , Adam Lewera
- Applicant: UNIWERSYTET WARSZAWSKI
- Applicant Address: PL Warsaw
- Assignee: UNIWERSYSTET WARSZAWSKI
- Current Assignee: UNIWERSYSTET WARSZAWSKI
- Current Assignee Address: PL Warsawa
- Agency: BROWDY AND NEIMARK, PLLC
- International Application: PCT/IB2015/059969 2015.12.23
- International Announcement: WO2017/109556A 2017.06.29
- Date entered country: 2018-06-20
- Main IPC: C23C18/44
- IPC: C23C18/44 ; C23C18/34 ; C23C18/40 ; C23C18/42
Abstract:
The present invention relates to a method of deposition of thin metal layers on different substrates by electroless chemical method. In the method of the invention, the potential of the plating solution, i.e. a solution from which the metal deposition is carried out, is controlled with a redox buffer. The appropriate plating solution is also disclosed.
Public/Granted literature
- US20190010609A1 MEANS FOR CARRYING OUT ELECTROLESS METAL DEPOSITION WITH ATOMIC SUB-MONOLAYER PRECISION Public/Granted day:2019-01-10
Information query
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