Invention Grant
- Patent Title: Insulation wire mounting system
-
Application No.: US17123094Application Date: 2020-12-15
-
Publication No.: US12024877B2Publication Date: 2024-07-02
- Inventor: David John Simonsen
- Applicant: David John Simonsen
- Applicant Address: US CA Redding
- Assignee: David John Simonsen
- Current Assignee: David John Simonsen
- Current Assignee Address: US CA Redding
- Main IPC: E04B1/49
- IPC: E04B1/49 ; E04B1/61 ; E04B1/90 ; E04B1/38

Abstract:
An insulation mounting system utilizing a thermal break consisting of radiused and/or straight channels, slots and holes for the purpose of mounting specially shaped formed wire to hold-in-place rigid insulation installed onto walls of buildings. A structural clip for further positioning, holding, bending and/or directing the same formed wire shapes. A sub-girt that attaches to the structural clips vertically or horizontally as needed, a wire bending tool for use at intermediate formed wire locations between assembled thermal clips, and an anti-reversal clip with bendable attachment arm for holding other building materials if needed. Multiple alternate embodiments for the thermal break, formed wires and structural clips show that there's an almost a limitless amount of variations that a person skilled in the art could imagine and not exceed the scope of the application.
Public/Granted literature
- US20220186489A1 Insulation Wire Mounting System Public/Granted day:2022-06-16
Information query