Invention Grant
- Patent Title: Bonded multilayer article
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Application No.: US17414708Application Date: 2019-12-18
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Publication No.: US12025258B2Publication Date: 2024-07-02
- Inventor: Ni Yan , Bhawesh Kumar , Brian J. Swanton , Lauren Tonge , Christophe R. Laroche , Mark Brown, II
- Applicant: Dow Global Technologies LLC , Dow Silicones Corporation
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC,Dow Silicones Corporation
- Current Assignee: Dow Global Technologies LLC,Dow Silicones Corporation
- Current Assignee Address: US MI Midland; US MI Midland
- International Application: PCT/US2019/067031 2019.12.18
- International Announcement: WO2020/131985A 2020.06.25
- Date entered country: 2021-06-16
- Main IPC: F16L59/14
- IPC: F16L59/14 ; B29C39/00 ; B29C39/12 ; B29L23/00 ; B32B1/08 ; B32B7/12 ; B32B25/08 ; B32B25/20 ; B32B38/00

Abstract:
A bonded multilayer article including: (a) at least one first layer of a silicone-containing rubber substrate material bonded to (b) at least one second layer of a substrate material bondable to the first layer; wherein at least a portion of the surface of the first layer is activated for adhesion to increase the bond strength of the first layer to a second layer such that the bond strength of the first layer bonded to the second layer is increased; and a process for producing the above bonded multilayer article.
Public/Granted literature
- US20220065387A1 BONED MULTILAYER ARTICLE Public/Granted day:2022-03-03
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