Invention Grant
- Patent Title: Liquid cooling device with water tank structure
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Application No.: US17831408Application Date: 2022-06-02
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Publication No.: US12025385B2Publication Date: 2024-07-02
- Inventor: Qineng Xiao
- Applicant: SHENZHEN APALTEK CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN APALTEK CO., LTD.
- Current Assignee: SHENZHEN APALTEK CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: HDLS IPR SERVICES
- Agent Chun-Ming Shih
- Priority: CN 1910744755.5 2019.08.13
- The original application number of the division: US16909959 2020.06.23
- Main IPC: F28F1/30
- IPC: F28F1/30 ; F28F9/02 ; H01L23/473 ; H05K7/20

Abstract:
A liquid cooling device includes a water tank structure having parallel and separated first and second water tanks. The heat dissipation structure is installed between the first and second water tanks and the three are coupled to each other to form a curved cooling water passage. A mounting portion is formed in the gap between the heat dissipation structure and the first and second water tanks in the extension direction of the heat dissipation structure and the first and second water tanks. Both of the pumping structure and the endothermic structure are coupled to the first and second water tanks. The pumping structure and the endothermic structure are installed in at least one mounting portion and the pumping structure drives a working fluid to flow back and forth between the first water tank, the heat dissipation structure and the second water tank in the curved cooling water passage sequentially.
Public/Granted literature
- US20220290930A1 LIQUID COOLING DEVICE Public/Granted day:2022-09-15
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