Invention Grant
- Patent Title: Electronic component testing apparatus, sockets, and replacement parts for electronic component testing apparatus
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Application No.: US18481760Application Date: 2023-10-05
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Publication No.: US12025654B2Publication Date: 2024-07-02
- Inventor: Natsuki Shiota , Hiroyuki Mineo
- Applicant: ADVANTEST Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST Corporation
- Current Assignee: ADVANTEST Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP 19232547 2019.12.24
- The original application number of the division: US17104913 2020.11.25
- Main IPC: G01R31/30
- IPC: G01R31/30 ; G01R1/04 ; G01R1/067 ; G01R1/073 ; G01R29/10 ; G01R31/28

Abstract:
An electronic component testing apparatus for testing a device under test (DUT) includes: a socket unit that is electrically connected to the DUT; a first wiring board that includes a board opening; and a tester that includes a test head in which the first wiring board is mounted. The socket unit includes a first socket that faces a first main surface of the DUT and is electrically connected to the DUT and the first wiring board. The second socket that is exposed from the first wiring board through the board opening, contacts a second main surface of the DUT on a side opposite to the first main surface, and includes: a base that contacts the second main surface; and a test antenna unit that is electrically connected to the tester and faces a device antenna unit of the DUT.
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