Invention Grant
- Patent Title: Optimized chirp signal shaping for ultrasonic sensing systems
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Application No.: US17081303Application Date: 2020-10-27
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Publication No.: US12025756B2Publication Date: 2024-07-02
- Inventor: Egbert Spiegel
- Applicant: Elmos Semiconductor SE
- Applicant Address: DE Dortmund
- Assignee: ELMOS SEMICONDUCTOR SE
- Current Assignee: ELMOS SEMICONDUCTOR SE
- Current Assignee Address: DE Dortmund
- Agency: Mindful IP PLLC
- Agent Michael J. McCandlish
- Priority: DE 2019130810.0 2019.11.14 DE 2019132483.1 2019.11.29 DE 2019132488.2 2019.11.29 DE 2020120416.7 2020.08.03 DE 2020120418.3 2020.08.03
- Main IPC: G01S7/524
- IPC: G01S7/524 ; G01S15/931

Abstract:
A method to operate an ultrasonic sensor includes the step of sending an ultrasonic burst as a series of ultrasonic pulses that have a pulse length and a pulse spacing. The sum of the pulse length and pulse spacing represents the pulse period length. The ultrasonic burst starts at a first time and ends at a second time. The current pulse frequency corresponds to an inverse of the current pulse length. The current pulse frequency, during a first time period passes through a first frequency range, in a following middle time period a middle frequency range and in a following second time period a second frequency range. The length of time of the middle time period is equal to or longer than the sum of the first time period and the second time period.
Public/Granted literature
- US20210149032A1 OPTIMIZED CHIRP SIGNAL SHAPING FOR ULTRASONIC SENSING SYSTEMS Public/Granted day:2021-05-20
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