Invention Grant
- Patent Title: Phase shift mask for EUV lithography and manufacturing method for the phase shift mask
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Application No.: US17529071Application Date: 2021-11-17
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Publication No.: US12025912B2Publication Date: 2024-07-02
- Inventor: Tae Joong Ha
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix inc.
- Current Assignee: SK hynix inc.
- Current Assignee Address: KR Icheon-si
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR 20210077710 2021.06.15
- Main IPC: G03F1/30
- IPC: G03F1/30

Abstract:
There is provided a phase shift mask for extreme-ultraviolet lithography and a method of manufacturing the phase shift mask. The phase shift mask includes a substrate, a reflective layer, device patterns, a frame pattern, or phase shift patterns. The frame pattern is a pattern that includes alignment holes exposing portions of the reflective layer. The phase shift patterns overlap with the device patterns.
Public/Granted literature
- US20220397818A1 PHASE SHIFT MASK FOR EUV LITHOGRAPHY AND MANUFACTURING METHOD FOR THE PHASE SHIFT MASK Public/Granted day:2022-12-15
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