Invention Grant
- Patent Title: Cooling unit, substrate treating apparatus including the same, and substrate treating method using the same
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Application No.: US17487170Application Date: 2021-09-28
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Publication No.: US12025921B2Publication Date: 2024-07-02
- Inventor: Jun Ho Kim , Sang Hoon Lee , Jong Seok Seo
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: Semes Co., Ltd.
- Current Assignee: Semes Co., Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200127273 2020.09.29
- Main IPC: G03F7/40
- IPC: G03F7/40

Abstract:
The inventive concept provides a cooling unit. In an embodiment, the cooling unit comprises: a cooling plate with a seating surface; a pin member arranged at the cooling plate and supporting a substrate; a decompression hole formed on the seating surface; a decompression path formed within the cooling plate and connected to the decompression hole; a decompression member for decompressing the decompression path; and a controller for controlling the decompression member, wherein the controller controls the decompression member to decompress a space between the substrate and the seating surface of the cooling plate and thereby adjusting a distance between the substrate and the seating surface of the cooling plate.
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