Invention Grant
- Patent Title: Conductive laminate, touch panel, and manufacturing method for conductive laminate
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Application No.: US17412711Application Date: 2021-08-26
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Publication No.: US12026330B2Publication Date: 2024-07-02
- Inventor: Daisuke Inoue
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP 19059120 2019.03.26
- Main IPC: G06F3/041
- IPC: G06F3/041 ; B32B17/10 ; C03C17/38
Abstract:
A conductive laminate includes a first organic film, a fine metal wire arranged on the first organic film, and a second organic film arranged to cover the fine metal wire, in which the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of the first organic film, and moisture contents of the first organic film and the second organic film are less than 3.00%.
Public/Granted literature
- US20210389834A1 CONDUCTIVE LAMINATE, TOUCH PANEL, AND MANUFACTURING METHOD FOR CONDUCTIVE LAMINATE Public/Granted day:2021-12-16
Information query
