Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US17815141Application Date: 2022-07-26
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Publication No.: US12027221B2Publication Date: 2024-07-02
- Inventor: Meng-Sheng Chang , Yao-Jen Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- The original application number of the division: US17143702 2021.01.07
- Main IPC: G11C17/18
- IPC: G11C17/18 ; G11C17/16 ; H10B20/20

Abstract:
An integrated circuit (IC) device includes a first active region extending along a first direction, a first pair of gate regions extending across the first active region along a second direction transverse to the first direction, and a first metal layer. The first pair of gate regions and the first active region configure a first program transistor and a first read transistor sharing a common source/drain region. The first metal layer includes a first program word line pattern over and coupled to the gate region of the first program transistor, a first read word line pattern over and coupled to the gate region of the first read transistor, a first source line pattern coupled to another source/drain region of the first program transistor, and a first bit line pattern coupled to another source/drain region of the first read transistor.
Public/Granted literature
- US20220359027A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2022-11-10
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