Invention Grant
- Patent Title: Substrate processing method and apparatus
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Application No.: US17206768Application Date: 2021-03-19
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Publication No.: US12027353B2Publication Date: 2024-07-02
- Inventor: Shota Ishibashi , Hiroyuki Toshima , Hiroyuki Iwashita , Tatsuo Hirasawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: JP 20053331 2020.03.24
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/35 ; H01J37/32

Abstract:
There is provided a substrate processing method of a substrate processing apparatus. The substrate processing apparatus includes at least two targets, magnet-moving mechanisms disposed in one-to-one correspondence with the at least two targets, each of the magnet-moving mechanisms being configured to reciprocate a magnet in a first direction on a back surface of each target, and a substrate moving mechanism configured to move a substrate in a second direction orthogonal to the first direction. The method includes causing the magnet-moving mechanisms to reciprocate the magnets at different phases with each other.
Public/Granted literature
- US20210305032A1 SUBSTRATE PROCESSING METHOD AND APPARATUS Public/Granted day:2021-09-30
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