Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
-
Application No.: US18297042Application Date: 2023-04-07
-
Publication No.: US12027394B2Publication Date: 2024-07-02
- Inventor: Hiroki Sakurai , Kazuki Kosai , Kazuyoshi Shinohara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP 20037866 2020.03.05
- Main IPC: B08B3/02
- IPC: B08B3/02 ; B08B7/04 ; B08B13/00 ; H01L21/67

Abstract:
A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.
Public/Granted literature
- US20230268207A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2023-08-24
Information query
IPC分类: