Invention Grant
- Patent Title: Substrate support apparatus and method
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Application No.: US15723505Application Date: 2017-10-03
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Publication No.: US12027407B2Publication Date: 2024-07-02
- Inventor: Yueh Lin Yang , Chi-Hung Liao , Fei-Gwo Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C14/50 ; C23C16/458 ; H01L21/673 ; H01L21/683 ; H01L21/687 ; H05K7/14

Abstract:
A substrate support apparatus includes a housing and a plurality of spherical supports. The housing has a top surface, the top surface including a plurality of openings. The housing is configured to position the plurality of spherical supports within the plurality of openings so that topmost surfaces of the plurality of spherical supports are arranged in a plane above the top surface. A spherical support of the plurality of spherical supports is rotatable within the housing.
Public/Granted literature
- US20190027392A1 SUBSTRATE SUPPORT APPARATUS AND METHOD Public/Granted day:2019-01-24
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