Invention Grant
- Patent Title: Package with clip having through hole accommodating component-related structure
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Application No.: US17575038Application Date: 2022-01-13
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Publication No.: US12027436B2Publication Date: 2024-07-02
- Inventor: Angela Kessler , Kok Yau Chua , Josef Hoeglauer , Chiah Chin Lim , Mei Qi Tay
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE 2021103050.1 2021.02.10
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/52 ; H01L23/31 ; H01L23/495 ; H01L23/538 ; H01L31/072 ; H01L31/109
Abstract:
A package and method of manufacturing is disclosed. In one example, the package which comprises a carrier with at least one component mounted on the carrier. A clip is arranged above the carrier and having a through hole. At least part of at least one of the at least one component and/or at least part of an electrically conductive connection element electrically connecting the at least one component is at least partially positioned inside the through hole.
Public/Granted literature
- US20220254696A1 PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELATED STRUCTURE Public/Granted day:2022-08-11
Information query
IPC分类:
