Invention Grant
- Patent Title: Method of additively manufacturing an integrated circuit of an interconnect packaging structure
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Application No.: US17056188Application Date: 2019-05-15
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Publication No.: US12027477B2Publication Date: 2024-07-02
- Inventor: Ioannis Papapolymerou , Premjeet Chahal , John D. Albrecht , Michael Thomas Craton , Christopher Oakley
- Applicant: Board of Trustees of Michigan State University
- Applicant Address: US MI East Lansing
- Assignee: Board of Trustees of Michigan State University
- Current Assignee: Board of Trustees of Michigan State University
- Current Assignee Address: US MI East Lansing
- Agency: Harness, Dickey & Pierce, PLC
- International Application: PCT/US2019/032501 2019.05.15
- International Announcement: WO2019/222410A 2019.11.21
- Date entered country: 2020-11-17
- Main IPC: H01L23/66
- IPC: H01L23/66 ; B33Y10/00 ; B33Y30/00 ; G01S7/02 ; G01S7/282 ; G01S13/931 ; H01L23/00
Abstract:
A method of manufacturing an interconnect packaging structure is provided. In one aspect, the method includes forming a first body defining a cavity around at least one integrated circuit using an additive manufacturing machine, depositing a conductive transmission line on the first body and electrically coupling the conductive transmission line and the at least one integrated circuit with a conductive interconnect.
Public/Granted literature
- US20210217712A1 MANUFACTURED INTERCONNECT PACKAGING STRUCTURE Public/Granted day:2021-07-15
Information query
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