Invention Grant
- Patent Title: Electronic package and carrier thereof and method for manufacturing the same
-
Application No.: US17369029Application Date: 2021-07-07
-
Publication No.: US12027484B2Publication Date: 2024-07-02
- Inventor: Chi-Ren Chen , Po-Yung Chang , Pei-Geng Weng , Yuan-Hung Hsu , Chang-Fu Lin , Don-Son Jiang
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, PLLC
- Priority: TW 0120226 2021.06.03
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/498
Abstract:
An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.
Public/Granted literature
- US20220392861A1 ELECTRONIC PACKAGE AND CARRIER THEREOF AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-12-08
Information query
IPC分类:
