Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing thereof
-
Application No.: US17199566Application Date: 2021-03-12
-
Publication No.: US12027521B2Publication Date: 2024-07-02
- Inventor: Shih-Yao Lin , Chieh-Ning Feng , Hsiao Wen Lee , Chao-Cheng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a dielectric fin between a first semiconductor channel and a second semiconductor channel. The semiconductor device includes a first gate structure. The first gate structure includes a first portion and a second portion separated from each other by the dielectric fin. The semiconductor device includes a first gate spacer that extends along sidewalls of the first portion of the first gate structure. The semiconductor device includes a second gate spacer that extends along sidewalls of the second portion of the first gate structure. At least one of the first gate spacer or second gate spacer has a first portion with a first thickness and a second portion with a second thickness less than the first thickness, and wherein the first portion is closer to the dielectric fin than the second portion.
Public/Granted literature
- US20220293594A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF Public/Granted day:2022-09-15
Information query
IPC分类: