Invention Grant
- Patent Title: Method for manufacturing silicon carbide semiconductor device
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Application No.: US17820304Application Date: 2022-08-17
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Publication No.: US12027576B2Publication Date: 2024-07-02
- Inventor: Tomoaki Noguchi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 20049005 2020.03.19
- The original application number of the division: US17021958 2020.09.15
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L29/04 ; H01L29/16 ; H01L29/66

Abstract:
A silicon carbide semiconductor device includes: a silicon carbide layer of a first conductive type including a defect region in which a crystal defect exists; a plurality of well regions of a second conductive type formed on the silicon carbide layer; source regions of the first conductive type formed in the well regions; gate oxide films formed on the silicon carbide layer, the well regions and the source regions; gate electrodes formed on the gate oxide films; and a source electrode electrically connected to the well regions and the source regions, wherein the source region is not formed in the defect region.
Public/Granted literature
- US20220392997A1 METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2022-12-08
Information query
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