Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18347090Application Date: 2023-07-05
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Publication No.: US12027586B2Publication Date: 2024-07-02
- Inventor: Cho-eun Lee , Seok-hoon Kim , Sang-gil Lee , Edward Cho , Min-hee Choi , Seung-hun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20180081588 2018.07.13
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/8234 ; H01L21/8238 ; H01L29/78

Abstract:
A semiconductor device includes: a fin-type active region extending on a substrate in a first direction that is parallel to an upper surface of the substrate; and a source/drain region in a recess region extending into the fin-type active region, wherein the source/drain region includes: a first source/drain material layer; a second source/drain material layer on the first source/drain material layer; and a first dopant diffusion barrier layer on an interface between the first source/drain material layer and the second source/drain material layer.
Public/Granted literature
- US20230352532A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-11-02
Information query
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