Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
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Application No.: US17515645Application Date: 2021-11-01
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Publication No.: US12027617B2Publication Date: 2024-07-02
- Inventor: Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JP 20209898 2020.12.18
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/76 ; H01L21/761 ; H01L29/06 ; H01L29/10 ; H01L29/16 ; H01L29/66

Abstract:
A voltage withstanding structure disposed in an edge termination region is a spatial modulation junction termination extension (JTE) structure formed by a combination of a JTE structure and a field limiting ring (FLR) structure. All FLRs configuring the FLR structure are surrounded by an innermost one of p−−-type regions configuring the JTE structure. An innermost one of the FLRs is disposed overlapping a p+-type extension and the innermost one of the p−−-type regions, at a position overlapping a border between the p+-type extension and the innermost one of the p−−-type regions. The FLRs are formed concurrently with p++-type contact regions in an active region and have an impurity concentration substantially equal to an impurity concentration of the p++-type contact regions. An n+-type channel stopper region is formed concurrently with n+-type source regions in the active region and has an impurity concentration substantially equal to an impurity concentration the n+-type source regions.
Public/Granted literature
- US20220199824A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2022-06-23
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