Invention Grant
- Patent Title: Process for producing adjacent chips comprising LED wires and device obtained by the process
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Application No.: US17232287Application Date: 2021-04-16
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Publication No.: US12027643B2Publication Date: 2024-07-02
- Inventor: Eric Pourquier , Hubert Bono
- Applicant: ALEDIA , COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Grenoble
- Assignee: ALEDIA,COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: ALEDIA,COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Grenoble; FR Paris
- Agency: BakerHostetler
- Priority: FR 62537 2012.12.21
- The original application number of the division: US14652435
- Main IPC: H01L33/08
- IPC: H01L33/08 ; B82Y10/00 ; B82Y40/00 ; H01L21/02 ; H01L27/15 ; H01L29/06 ; H01L29/12 ; H01L29/66 ; H01L33/00 ; H01L33/06 ; H01L33/16 ; H01L33/18 ; H01L33/24 ; H01L33/42 ; H01L33/48 ; H10B69/00 ; H01L33/02

Abstract:
A process for producing at least two adjacent regions, each comprising an array of light-emitting wires connected together in a given region by a transparent conductive layer, comprises: producing, on a substrate, a plurality of individual zones for growing wires extending over an area greater than the cumulative area of the two chips; growing wires in the individual growth zones; removing wires from at least one zone forming an initial free area to define the arrays of wires, the initial free area comprising individual growth zones level with the removed wires; and depositing a transparent conductive layer on each array of wires to electrically connect the wires of a given array of wires, each conductive layer being separated from the conductive layer of the neighbouring region by a free area. A device obtained using the process of the invention is also provided.
Public/Granted literature
- US20210234066A1 PROCESS FOR PRODUCING ADJACENT CHIPS COMPRISING LED WIRES AND DEVICE OBTAINED BY THE PROCESS Public/Granted day:2021-07-29
Information query
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