Invention Grant
- Patent Title: Methods and devices for preventing thermally-induced stress cracks in large footprint solid oxide fuel cell columns
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Application No.: US18053834Application Date: 2022-11-09
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Publication No.: US12027728B2Publication Date: 2024-07-02
- Inventor: Michael Gasda , Sachin Parhar , Cheng-Yu Lin , Victor Fung , Amit Nawathe , Brian Therault , Manoj Pillai
- Applicant: BLOOM ENERGY CORPORATION
- Applicant Address: US CA San Jose
- Assignee: BLOOM ENERGY CORPORATION
- Current Assignee: BLOOM ENERGY CORPORATION
- Current Assignee Address: US CA San Jose
- Agency: THE MARBURY LAW GROUP PLLC
- Main IPC: H01M8/12
- IPC: H01M8/12 ; C22C27/06 ; C25B9/65 ; H01M8/0208 ; H01M8/0228 ; H01M8/2425
Abstract:
A method of making an interconnect for an electrochemical cell stack includes providing the interconnect, and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.
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