Invention Grant
- Patent Title: Dielectric filter and communication device
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Application No.: US17895670Application Date: 2022-08-25
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Publication No.: US12027741B2Publication Date: 2024-07-02
- Inventor: Meng Zou , Jing Shi
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Fish & Richardson P.C.
- Priority: CN 2010131057.0 2020.02.28
- Main IPC: H01P1/202
- IPC: H01P1/202 ; H01P1/20 ; H01P1/201 ; H01P1/205 ; H01P3/16

Abstract:
Embodiments of this application disclose a dielectric filter and a communication device. In one example, the dielectric filter includes: a first dielectric block and a second dielectric block that are stacked up, where a first surface of the first dielectric block is opposite to a second surface of the second dielectric block; a first blind hole, a first through hole, and two or more resonance through holes whose openings are located on the first surface of the first dielectric block, and a second through hole whose opening is located on the second surface of the second dielectric block. A metal layer on the first surface of the first dielectric block is connected to a metal layer on the second surface of the second dielectric block.
Public/Granted literature
- US20220416384A1 DIELECTRIC FILTER AND COMMUNICATION DEVICE Public/Granted day:2022-12-29
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