Invention Grant
- Patent Title: Transmission apparatus, printed circuit board, and information appliance
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Application No.: US17309427Application Date: 2019-09-05
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Publication No.: US12027743B2Publication Date: 2024-07-02
- Inventor: Kazuya Sawada
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 18228868 2018.12.06
- International Application: PCT/JP2019/035066 2019.09.05
- International Announcement: WO2020/115978A 2020.06.11
- Date entered country: 2021-05-26
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/08 ; H01P5/02 ; H01P5/04 ; H01P5/16 ; H03F1/56 ; H03F3/195 ; H03F3/21 ; H03F3/213 ; H03F3/60 ; H05K1/11

Abstract:
There is provided a transmission apparatus having a transmission line into which a low-impedance part is inserted. The transmission apparatus includes a package having a first impedance, a first transmission line and a second transmission line respectively connected on either side of the package and having a second impedance different from the first impedance, and an intermediate section respectively disposed in a connection between the package and the first transmission line and in a connection between the package and the second transmission line. The intermediate section is adjusted to have an electrical length of λ/4 (where λ is an electromagnetic wavelength corresponding to a desired frequency) and an impedance that is intermediate between the first impedance and the second impedance.
Public/Granted literature
- US20220294095A1 TRANSMISSION APPARATUS, PRINTED CIRCUIT BOARD, AND INFORMATION APPLIANCE Public/Granted day:2022-09-15
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