Invention Grant
- Patent Title: Board to board connectors
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Application No.: US17419806Application Date: 2019-07-31
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Publication No.: US12027791B2Publication Date: 2024-07-02
- Inventor: Hung-Ming Lin , Chin-Chang Ho , Jui-Hsuan Chang , Shaheen Saroor
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Quarles & Brady LLP
- International Application: PCT/US2019/044481 2019.07.31
- International Announcement: WO2021/021190A 2021.02.04
- Date entered country: 2021-06-30
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/72 ; H01R12/73

Abstract:
A board to board connector includes a first male connector and a second male connector. The first male connector includes a first number of pins. The second male connector is aligned with the first male connector and includes a second number of pins. The first male connector is configured to be removably electrically coupled to a first female connector including a third number of pins equal to the first number and the second male connector is configured to be removably electrically coupled to a second female connector including a fourth number of pins equal to the second number. The first male connector and the second male connector are also configured to be removably electrically coupled to a single third female connector including a fifth number of pins equal to the first number plus the second number.
Public/Granted literature
- US20220149552A1 BOARD TO BOARD CONNECTORS Public/Granted day:2022-05-12
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