Invention Grant
- Patent Title: Data center interconnect
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Application No.: US17814213Application Date: 2022-07-21
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Publication No.: US12028663B2Publication Date: 2024-07-02
- Inventor: Ting-Kuang Chiang
- Applicant: Infinera Corp.
- Applicant Address: US CA San Jose
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA San Jose
- Agent David L. Soltz
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04Q11/00 ; H04J14/00

Abstract:
Comprises aggregating data received by a first number of server ports of an edge switch. The server ports operate at a first data speed. The aggregated data is distributed into a plurality of virtual lanes with each virtual lane carrying a portion of the aggregated data at a second data speed less than the first data speed.
Public/Granted literature
- US20230024349A1 DATA CENTER INTERCONNECT Public/Granted day:2023-01-26
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