Invention Grant
- Patent Title: Double-sided circuit non-oxide-based ceramic substrate and method for manufacturing same
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Application No.: US17727026Application Date: 2022-04-22
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Publication No.: US12028984B2Publication Date: 2024-07-02
- Inventor: Hideaki Takemori , Satoshi Higashiyama , Toru Itagaki
- Applicant: Hitachi Power Solutions Co., Ltd.
- Applicant Address: JP Hitachi
- Assignee: Hitachi Power Solutions Co., Ltd.
- Current Assignee: Hitachi Power Solutions Co., Ltd.
- Current Assignee Address: JP Hitachi
- Agency: Crowell & Moring LLP
- Priority: JP 18134431 2018.07.17
- The original application number of the division: US16502291 2019.07.03
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/03 ; H05K3/40 ; H05K3/46

Abstract:
The object of the invention is to provide a double-sided circuit non-oxide-based ceramic substrate excellent in radiation property and low in cost, and a method for manufacturing the same. A double-sided circuit non-oxide-based ceramic substrate related to the present invention includes a high heat-conductive non-oxide-based ceramic substrate that includes a through hole, a holding layer that is formed on a wall surface of the through hole, and an electro-conductive metal section that is held inside the through hole by the holding layer and does not include an active metal. The double-sided circuit non-oxide-based ceramic substrate related to the present invention preferably includes electrodes (thin film electrodes) that shield end surfaces of the holding layer and end surfaces of the electro-conductive metal section which are exposed to front and back surfaces of the ceramic substrate.
Public/Granted literature
- US20220248537A1 Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method for Manufacturing Same Public/Granted day:2022-08-04
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