Invention Grant
- Patent Title: Mounting method and mounting structure formed by the same
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Application No.: US17367269Application Date: 2021-07-02
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Publication No.: US12028986B2Publication Date: 2024-07-02
- Inventor: Naomichi Ohashi , Yasuhiro Okawa , Koso Matsuno
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 20126689 2020.07.27
- Main IPC: B23K1/00
- IPC: B23K1/00 ; H05K1/03 ; H05K1/09 ; H05K3/34 ; B23K101/40 ; B23K103/00
Abstract:
A method for mounting an electronic component on a resin base material, the method including:
(1) preparing the resin base material having a wiring pattern formed of a conductive paste;
(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;
(3) placing the electronic component on the solder paste; and
(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein
a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.
(1) preparing the resin base material having a wiring pattern formed of a conductive paste;
(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;
(3) placing the electronic component on the solder paste; and
(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein
a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.
Public/Granted literature
- US20220030721A1 MOUNTING METHOD AND MOUNTING STRUCTURE FORMED BY THE SAME Public/Granted day:2022-01-27
Information query
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