Invention Grant
- Patent Title: Waterproof connecting structure and electronic device
-
Application No.: US17694849Application Date: 2022-03-15
-
Publication No.: US12029000B2Publication Date: 2024-07-02
- Inventor: Bo-Duo Yuan , Yan-Lei Cao
- Applicant: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Zhengzhou
- Assignee: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Zhengzhou; TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN 2110304057.0 2021.03.22
- Main IPC: H05K5/06
- IPC: H05K5/06 ; H04M1/02 ; H05K5/02

Abstract:
A waterproof connecting structure includes a first housing, a second housing employs a waterproof adhesive layer between the two. The first housing includes a first mounting member with a first groove, the first groove includes a first recessed area. The second housing includes a second recessed area and a protrusion of a certain shape. The second recessed area surrounds an edge of the second housing, the protrusion is disposed close to the second recessed area, and penetrates into the first recessed area. The waterproof adhesive layer is disposed between the first housing and the second housing, and is accommodated in the first groove and the second recessed area. An electronic device including the waterproof connecting structure is also provided.
Public/Granted literature
- US20220304176A1 WATERPROOF CONNECTING STRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2022-09-22
Information query