- Patent Title: System and method for repurposing waste heat in computing devices
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Application No.: US17871692Application Date: 2022-07-22
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Publication No.: US12029006B2Publication Date: 2024-07-02
- Inventor: Steven L. Williams , David William Grunow , Qinghogn He
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
Methods and systems for thermally managing data processing systems are disclosed. Data processing systems may provide computer implemented services to users thereof and/or other devices. The data processing systems may include various hardware components that perform computations used to provide the computer implemented services and may generate heat as a byproduct. To dissipate the heat generated by the hardware components, airflows proximate to the hardware components may be used to extract the heat. Once extracted, the heated airflows may be exhausted from the data processing systems. To facilitate use of the exhausted airflows, the airflows may be selectively directed in accordance with user preferences.
Public/Granted literature
- US20240032239A1 SYSTEM AND METHOD FOR REPURPOSING WASTE HEAT IN COMPUTING DEVICES Public/Granted day:2024-01-25
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