A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.