Invention Grant
- Patent Title: Memory array circuit and method of manufacturing same
-
Application No.: US18304301Application Date: 2023-04-20
-
Publication No.: US12029023B2Publication Date: 2024-07-02
- Inventor: Hidehiro Fujiwara , Chih-Yu Lin , Hsien-Yu Pan , Yasutoshi Okuno , Yen-Huei Chen , Hung-Jen Liao
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- The original application number of the division: US16457553 2019.06.28
- Main IPC: H10B10/00
- IPC: H10B10/00 ; G06F30/392 ; H01L23/522 ; H01L23/528 ; H01L27/02

Abstract:
A method of forming a memory circuit includes generating a layout design of the memory circuit, and manufacturing the memory circuit based on the layout design. The generating of the layout design includes generating a first active region layout pattern corresponding to fabricating a first active region of a first pull down transistor, generating a second active region layout pattern corresponding to fabricating a second active region of a first pass gate transistor, and generating a first metal contact layout pattern corresponding to fabricating a first metal contact. The first metal contact layout pattern overlaps the cell boundary of the memory circuit and the first active region layout pattern. The first metal contact electrically coupled to a source of the first pull down transistor. The memory circuit being a four transistor (4T) memory cell including a first and second pass gate transistor, and a first and second pull down transistor.
Public/Granted literature
- US20230301049A1 MEMORY ARRAY CIRCUIT AND METHOD OF MANUFACTURING SAME Public/Granted day:2023-09-21
Information query