Invention Grant
- Patent Title: Semiconductor device structure
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Application No.: US17839047Application Date: 2022-06-13
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Publication No.: US12029025B2Publication Date: 2024-07-02
- Inventor: Ta-Chun Lin , Kuo-Hua Pan
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H10B10/00
- IPC: H10B10/00 ; H01L21/02 ; H01L21/306 ; H01L21/308 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a first device formed over a substrate, wherein the first device includes a first fin structure and a first S/D structure formed over the first fin structure. The semiconductor device structure includes a second device formed over or below the first device, and the second device includes a plurality of second nanostructures stacked in a vertical direction. The semiconductor device structure also includes a second S/D structure formed over the second nanostructures, and the second S/D structure is directly above or below the first S/D structure.
Public/Granted literature
- US20220320116A1 SEMICONDUCTOR DEVICE STRUCTURE Public/Granted day:2022-10-06
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