• Patent Title: Optoelectronic component and method for contacting an optoelectronic component
  • Application No.: US17774481
    Application Date: 2020-11-05
  • Publication No.: US12029053B2
    Publication Date: 2024-07-02
  • Inventor: Ralph Wichtendahl
  • Applicant: HELIATEK GMBH
  • Applicant Address: DE Dresden
  • Assignee: HELIATEK GMBH
  • Current Assignee: HELIATEK GMBH
  • Current Assignee Address: DE Dresden
  • Agency: LEYDIG, VOIT & MAYER, LTD.
  • Priority: DE 2019129832.6 2019.11.05
  • International Application: PCT/DE2020/100950 2020.11.05
  • International Announcement: WO2021/089089A 2021.05.14
  • Date entered country: 2022-05-05
  • Main IPC: H10K30/83
  • IPC: H10K30/83 H10K30/20 H10K30/88
Optoelectronic component and method for contacting an optoelectronic component
Abstract:
An optoelectronic component, including: a bottom electrode, a top electrode, a layer system having at least one photoactive layer, the layer system being disposed between the bottom electrode and the top electrode, a planarization layer disposed on a side of the bottom electrode and/or top electrode facing away from the layer system, at least one barrier layer disposed on the planarization layer, and at least one busbar, the at least one busbar being disposed on the at least one barrier layer, wherein: the planarization layer has electrically conductive particles the electrically conductive particles being introduced into the planarization layer, and the electrically conductive particles electrically conductively bridge the planarization layer through the at least one barrier layer such that the bottom electrode and/or the top electrode electrically conductively contacts the at least one busbar.
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