A first metal layer that is formed by a first metal film is provided in an island shape along a pair of third wiring lines that is adjacent to each other. The first metal layer overlaps a region that is surrounded by a pair of first wiring lines, among several first wiring lines extending parallel to each other and formed by a first metal film, that is adjacent to each other, and the pair of third wiring lines, among several third wiring lines extending parallel to each other and in a direction intersecting each of the several first wiring lines.