A method for manufacturing a display device includes a mounting process in which a frame terminal of a flexible display panel and a counter terminal of a flexible printed circuit substrate are electrically connected by thermocompression bonding. In the mounting process, the thermocompression bonding is performed in a state in which the flexible display panel is folded so that the flexible display panel includes an abutting portion abutting on a mounting stage and a folding portion where the flexible display panel is to be folded over the abutting portion in plan view.