Invention Grant
- Patent Title: Thermoelectric conversion module, insulated circuit substrate, method for bonding members, and method for attaching a thermoelectric conversion module
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Application No.: US17798435Application Date: 2021-02-19
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Publication No.: US12029124B2Publication Date: 2024-07-02
- Inventor: Koya Arai
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP 20026446 2020.02.19
- International Application: PCT/JP2021/006451 2021.02.19
- International Announcement: WO2021/167089A 2021.08.26
- Date entered country: 2022-08-09
- Main IPC: H10N10/17
- IPC: H10N10/17 ; H10N10/813

Abstract:
A thermoelectric conversion module is formed by arranging, on one surface, a plurality of thermoelectric conversion element pairs in which an n-type thermoelectric conversion element and a p-type thermoelectric conversion element are connected by interposing an electrode plate, and connecting the plurality of the thermoelectric conversion element pairs in series; and the thermoelectric conversion module has a first output terminal provided on one thermoelectric conversion element pair arranged at one end side of the plurality of the thermoelectric conversion element pairs connected in series, a second output terminal provided on the other thermoelectric conversion element pair arranged at the other end side of the plurality of the thermoelectric conversion element pairs connected in series, and an intermediate output terminal provided at any position between the thermoelectric conversion element pair arranged at the one end side and the thermoelectric conversion element pair arranged at the other end side.
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