A molding system is provided, which includes at least one mold part and a heating and cooling module. The at least one mold part defines a mold cavity having an opening. The heating and cooling module is inserted into the opening to close the mold cavity. The heating and cooling module includes a die insert defining a mold surface, a layered heater for heating the mold surface, and a cooling unit for cooling the mold surface. The layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.