Invention Grant
- Patent Title: Print component with memory circuit
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Application No.: US18448794Application Date: 2023-08-11
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Publication No.: US12030312B2Publication Date: 2024-07-09
- Inventor: Boon Bing Ng , James Michael Gardner , Scott A. Linn
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/045
- IPC: B41J2/045 ; G06F3/12 ; G06F13/16 ; G11C7/10 ; G11C16/10 ; G11C16/26

Abstract:
A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signal paths which communicate operating signals to the print component. The memory circuit includes a controllable selector connected in line with one of the signal paths via the I/O pads, the selector controllable to disconnect the corresponding signal path to the print component, and a memory component to store memory values associated with the print component. A control circuit, in response to a sequence of operating signals received by the I/O pads representing a memory read, to operate the controllable selector to disconnect the signal path to the print component to block the memory read of the print component, and provide an analog signal to the analog pad to provide an analog electrical value at the analog pad representing stored memory values selected by the memory read.
Public/Granted literature
- US20230382105A1 PRINT COMPONENT WITH MEMORY CIRCUIT Public/Granted day:2023-11-30
Information query
IPC分类: