The aim of the present invention is to provide a metal powder for an electroconductive paste with which a low-resistance electrode film can be formed. One embodiment of the present invention relates to a platinum-containing or platinum-alloy-containing metal powder for an electroconductive paste, the metal powder including a metal element or metal elements other than Pt, wherein the metal elements other than Pt include at least Ca, and may further include Al and Zr, and the total content of the Ca, Al and Zr among the metal elements other than Pt is 10-900 mass ppm.